Mohammed Kasem, Ph.D.
2321 Regina Court * Santa Clara * CA 95054
Tel:  [Send email to request phone number] 72.0617 * 

VP/Sr. Director - Design, Development + Manufacturing -Advanced Interconnects,
Surface Mount Packages - Semiconductors and Electronics
* An acknowledged expert in the design, development and manufacturing of
advanced interconnects, surface mount packages (including wafer-level chip scale
packages, flip-chips, and integrated multi-chip modules) for semiconductors, and
electronics:
o Noted international speaker and prolific contributor to industry journals - a
highly regarded strategist, both in terms of new product development and
manufacturing;
o 34 patents covering new product designs as well as manufacturing processes -
responsible for numerous industry 'firsts' in both areas.
* As Senior Director (de facto VP) - direct report to CEO and member of top
management team of $600 million revenue Vishay Siliconix, developed strategies
and directed worldwide design, development and manufacturing of advanced
interconnects, surface mount, and flip chip-wafer level chip scale products for
all business units:
o Transformed the company from a single, conventional manufacturing site with
sales of circa $100 million into a multi-site, low cost, world class assembly and
lean manufacturing operation spanning the US, the Far East, and the Middle East
with sales of over $600 million;
o Designed, developed and manufactured some 90-100 new and 150 upgraded products
annually, within tightly defined financial parameters for gross margin and
investment pay-back;
o Recruited and shaped a multi-cultural team into one of the leanest and most
productive teams in the global industry;
o Implemented low cost manufacturing operations and lean manufacturing
initiatives including continuous improvement, integrated supply chain and quality
compliance programs in the US, China, Taiwan, and Israel.
* Earlier, as Manager, Advanced Package Development and Manufacturing,
Sunken-Allegro Microsystems, developed and commercialized the company's first
plastic surface mount SOIC and PLCC packages for power management ICs and
Hall-Effect sensor ICs markets.
* As Senior Manufacturing Development Engineer, Raytheon Microwave, responsible
for company's first high power modules for GaAs MMIC amplifiers for radar systems
and first mass production line for manufacturing GaAs MESFETs and MMICs per
Defense and Space qualifications.

Professional Experience

VISHAY SILICONIX, Santa Clara, CA, 1992-present
Siliconix is an industry leader in the development of power semiconductor
products that improve the efficiency of power management circuitry while reducing
space requirements. The world's number 1 brand of low power MOSFETs. Siliconix
ICs address markets ranging from mobile communications and computing to the fixed
telecom infrastructure and include switchmode regulators, linear regulators and
power management devices. Siliconix was acquired by $2.8 billion revenue Vishay
Intertechnology in 1998.
Senior Director (de facto VP), 1992-present
Recruited by former boss to drive new product development and transform a
conventional US manufacturing business into a world-class lean, low cost
international manufacturing operation. Reported directly to CEO and member of
executive leadership team. Responsible for 7 managers and 65 personnel in US,
China, Taiwan and Israel.
 * Positioned the company as a world leader in power discrete semiconductor and
integrated circuit markets through the commercialization of numerous new products
based on several advanced interconnects and surface mount packaging
technologies.
 * Developed a broad portfolio of industry first packages such as MICRO FOOT(r),
PowerPAK(r), PolarPAK(r), PowerPAIR(tm), and FunctionPAK(tm) which have
contributed directly to the company's profits and growth.
 * Consistently met or exceeded the company's revenue plan to increase the
percentage of sales generated by new products, set at 30% annually.
VISHAY SILICONIX (continued)
 * Pioneered/developed and implemented the company's first:
 * electroless nickel plating process and infrastructure for high end power
devices - reducing the manufacturing cost of under bump metallization for 6" and
8" wafers by 75% - annual savings in excess of $4 million;
 * copper wire bonding process and infrastructure to replace the conventional
gold wire bonding in all MOSFET products - annual savings in excess of $10
million;
 * bond wireless, multichip module technology including the 35A PowerPAK(r)
which is superior to competitor products by 30% in performance at 60% lower
manufacturing cost.
 * Invented industry-first bond wireless process for single sided and double
sided cooling using soldered copper contacts to replace gold wires in devices.
 * Launched and commercialized the first wafer level chip-scale packaging
process for ultra small flip-chip devices which yielded highest margin over the
last seven years.
 * Developed manufacturing cost models and championed assembly yield improvement
programs.
 * Collaborated with the quality and operation organizations to drive
manufacturing quality systems, environmental compliance programs and supply chain
activities.
 * Coordinated the global ROHS programs for manufacturing including lead-free
and green electronics initiatives.
 * Visited major international customers to update and promote latest products
and package technology roadmaps.
 * Managed the operating and equipment capital budgets for seven worldwide
organizations and monitored performance and variance to budget and took
appropriate actions to meet the financial guidelines.
ALLEGRO MICROSYSTEMS, INC., Worcester, MA, 1986 -1992
One of the world leaders in the design and manufacture of Hall-Effect sensors
used in braking, steering, suspension and other automotive systems. This $320
million sales company also makes power semiconductors used in office equipment
and portable devices. The company is a subsidiary of Sanken Electric of Japan.
Manager, Advanced Package Development and Manufacturing, 1986 -1992
Recruited by former boss.
 * Set up the company's first surface mount plastic assembly line in the
Philippines - interfacing with equipment vendors and operation manager.
 * Supervised the assembly of Allegro's military products at Amkor assembly
subcontractor in Korea.
 * Established the company's first device thermal characterization lab and 3D
thermal computer modeling capability for all products.
RAYTHEON MICROWAVE DIVISION, Northborough, MA, 1982-1986
A divisi n of $23.2 billion sales Raytheon Corporation.
Senior Manufacturing Development Engineer, 1982-1986
 * Established the company's first device thermal characterization and
thermal/mechanical modeling capability for power devices and amplifiers.
WESTINGHOUSE SEMICONUCTOR DIVISION (now Mitsubishi-Powerex), 1980 -1982
Powerex is a leader in very high power semiconductors including IGBT; MOSFET
Modules; Intelligent Power Modules (IPM); and Custom Modules for transportation,
AC and DC motor controls, electric vehicles, and aircraft markets.
Development Engineer, 1980 -1982
 * Designed commercial and hermetic power integrated modules, and developed the
company's first packaging capability for high power bi polar transistor.
Pioneered and applied computer finite element software to design next generation
high power modules.
Patents and Publications - listing available upon request.

Education

Ph.D., Manufacturing Systems Engineering, Century University - Albuquerque, NM.
MS, Mechanical Engineering, Howard University - Washington D.C.
BS, Chemical Engineering, Cairo University - Cairo, Egypt.
Graduate of Harvard Business School Programs in Management.